| Kovar与K4玻璃阳极焊接机理及影响因素 |
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| 引用本文： | 王传杰,喻萍,薛锦.Kovar与K4玻璃阳极焊接机理及影响因素[J].西安科技大学学报,2007,27(3):427-430. |
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| 作者姓名： | 王传杰 喻萍 薛锦 |
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| 作者单位： | 1. 集美大学,工程技术学院,福建,厦门,361021
2. 西安交通大学,焊接研究所,陕西,西安,710049 |
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| 摘 要： | 分析了Kovar合金与K4玻璃阳极焊的结合机理和主要工艺参数对连接过程的影响,提出了金属与玻璃的连接机理为电场和温度场作用下的离子迁移、复合氧化物过渡层的生成和沉积,电压、温度、压力及试样表面质量是影响离子迁移和结合的主要因素,相匹配的热膨胀系数是防止开裂保证良好连接的必要条件。
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| 关 键 词： | 阳极焊 连接机理 离子迁移 |
| 文章编号： | 1672-9315（2007）03-0427-04 |
| 修稿时间： | 2007-08-30 |
Anodic bonding between Kovar Alloy and K4 glass |
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| WANG Chuan-jie,YU Ping,XUE Jin.Anodic bonding between Kovar Alloy and K4 glass[J].JOurnal of XI’an University of Science and Technology,2007,27(3):427-430. |
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| Authors: | WANG Chuan-jie YU Ping XUE Jin |
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| Abstract: | The anodic bonding mechanism between Kovar alloy and K4glass is analyzed and the effects of main technology parameters on bonding process are discussed.It is put forward that ionic migration,creation and deposition of composite oxides under certain temperature and electric field result in good bonding between Kovar alloy and K4 glass.Voltage,temperature,pressure and surface quality of specimen are main factors which affect the ions migration and bonding quality.Suited thermal expansion coefficients is the necessary conditions for preventing cracking and good bonding. |
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| Keywords: | anodic bonding bonding mechanism ionic migration |
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