导电胶研究进展

 导电胶作为新兴的电子产品黏结剂，具有许多传统黏结剂难以具备的优势。本文介绍了导电胶的组成及4种主要的导电机制；根据不同种类导电填料，阐述了导电胶的研究现状；针对导电胶的缺陷，从导电性能、接触电阻稳定性及力学性能3个方面综述了导电胶改性研究的进展；探讨了导电胶的发展趋势，展望了导电胶的发展前景。

Research progress of conductive adhesives

As the emerging adhesives for electronics, the electronical conductive adhesives (ECAs) enjoy many advantages,such as the lower processing temperature, the simpler processing procedures and the finer-pitch interconnection in comparison with the traditional soldering technology. This paper reviews four main types of ECAs based on different conductive fillers, as well as the research progresses of the ECAs from three aspects:The electrical conductivity, the contact resistance and the mechanical property. This applications of the ECAs may open up the possibility of developing the next generation innovative bio-nano electronic devices.