锡焊动态过程的研究

本文讨论了用润湿称量法取得铜丝,铁丝,铝丝在锡钎料中的润曲线。通过计算机拟合,取得了实测润湿力与时间的函数方程为f(t)=Ae~(B1)+C。经变换又得出Nernst溶解定律的相似方程C=K_2C_0(1-e~(B1))。润湿界面的金相组织与扫描电镜分析也同样证实在铜、铁、铝锡钎焊时,发生了扩散,溶解与界面化学反应过程。

On the Kinetic Process of Soldering

By means of a tension balance wetting device, which monitors the kinetic process of wetting action, the curves of wetting tension forces vs time of Cu,Fe, Al in molten tin solders can be recorded, Fitted by computer, these curves of wetting tension force vs time may be deseribed as equation f(t)=A exp~(Bt) c.Mathematical transformation of wetring curves has resulted in the similar equation of Nemst dissolving Law c=k_2Co(1-en~(Bt)),The constants A,B,C in the above equations show that the wetting action during soldering is a dissolution controlling process and the characteristics of diffusion, dissolution and chemical reaction on the liquid-solid boundary in thermal process of soldering are describcd. A metallographical and a SEM photomicrographical analysis of the wetting region show that Cu, Fe,Al are diffused, dissolved and reacted in tin solders.