| 聚酰亚胺表面钝化工艺 |
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| 引用本文： | 龚红,梁蓓.聚酰亚胺表面钝化工艺[J].贵州大学学报(自然科学版),2007,24(1):90-93. |
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| 作者姓名： | 龚红 梁蓓 |
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| 作者单位： | 贵州大学,电子科学系,贵州,贵阳,550025 |
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| 摘 要： | 介绍了聚酰亚胺(PI)作为硅双极型大功率开关器件芯片制造阶段表面钝化膜的工艺技术,该钝化工艺的工艺简单、成本低且能与普通的硅平面制造工艺兼容。实验表明,该工艺的使用能提高器件的可靠性,降低生产成本。
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| 关 键 词： | 聚酰亚胺 表面钝化 化学腐蚀 亚胺化 |
| 文章编号： | 1000-5269（2007）01-0090-04 |
| 修稿时间： | 2006-11-20 |
Surface Passivation Process with Polyimide |
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| GONG Hong,LIANG Bei.Surface Passivation Process with Polyimide[J].Journal of Guizhou University(Natural Science),2007,24(1):90-93. |
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| Authors: | GONG Hong LIANG Bei |
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| Abstract: | Author introduces a process technology that the Polyimide(PI) is used as the surface passivating of the Si bipolar high-power devices about chip madding phase.The process has the advantages of simple process,costing cheaply and being compatible with the common flat madding process.Experiments shows the process can improve the reliability of devices and reduce the cost of production. |
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| Keywords: | Polyimide(PI) surface passivating chemical corrosion imidization |
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