| LTCC中的寄生效应:材料的开发现状和展望 |
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| 引用本文： | 郭贵芳,贺志新,郭继华,刘刚.LTCC中的寄生效应:材料的开发现状和展望[J].北京联合大学学报(自然科学版),2008,22(4). |
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| 作者姓名： | 郭贵芳 贺志新 郭继华 刘刚 |
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| 作者单位： | 天津工业大学,材料科学与化工学院,天津,300160;北京七星华刨电子股份有限公司,北京,100016 |
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| 摘 要： | 为了消除LTCC中的寄生效应,必须优选电路及布线设计,并合理地选择材料,采用加工精度更高的工艺.描述了在材料及其过程研究中的进展,包括收缩、通孔对位、RLC的精确控制和细线制造.
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| 关 键 词： | LTCC 寄生效应 收缩 通孔对位 金属化 |
Parasitic Effect in LTCC:Present Developments in Materials |
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| GUO Gui-fang,HE Zhi-xin,GUO Ji-hua,LIU Gang.Parasitic Effect in LTCC:Present Developments in Materials[J].Journal of Beijing Union University,2008,22(4). |
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| Authors: | GUO Gui-fang HE Zhi-xin GUO Ji-hua LIU Gang |
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| Institution: | GUO Gui-fang~1,HE Zhi-xin~2,GUO Ji-hua~2,LIU Gang~1(1.College of Materials Science , Chemical Engineering,Tianjin Polytechnic University,Tianjin 300160,China,2.Beijing Sevenstar Electronics Co.,Ltd.Beijing 100016) |
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| Abstract: | To have parasitic effect in LTCC under control,we have to not only optimize the designs of the circuits and the layout,but also achieve finer and more accurate line definition through the use of new materials and processing technology.This paper reports our current developments in this area,including the shrinkage, the vias and registration,the control of R/L/C and the fine line manufacture. |
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| Keywords: | LTCC |
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