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Fe-B合金化学沉积的影响因素分析
引用本文:黄桂芳,黄维清,王玲玲,朱一村,王巧玲,张建辉.Fe-B合金化学沉积的影响因素分析[J].湖南大学学报(自然科学版),2007,34(1):52-55.
作者姓名:黄桂芳  黄维清  王玲玲  朱一村  王巧玲  张建辉
作者单位:1. 湖南大学,物理与微电子科学学院,湖南,长沙,410082
2. 长沙环境保护职业技术学院,湖南,长沙,410004
基金项目:湖南省自然科学基金资助项目(05JJ30089)
摘    要:通过化学沉积法制备Fe-B化学镀层,用电化学方法分析了偶接铝、镀液组分和沉积工艺对Fe-B化学沉积行为的影响.结果表明,偶接铝使体系的沉积电位负移,降低了Fe-B合金化学沉积的极化阻力,特别是金属离子还原的极化阻力,从而诱导Fe-B的化学沉积.镀层的沉积速率依赖于镀液组分和沉积工艺.

关 键 词:Fe-B合金  化学沉积  沉积速率  偶接铝  电化学
文章编号:1000-2472(2007)01-0052-04
修稿时间:2006-06-22

Analysis of the Effects on the Deposition of Electroless Fe-B Film
HUANG Gui-Fang,HUANG Wei-Qing,WANG Ling-ling,ZHU Yi-Cun,WANG Qiao-ling,ZHANG Jian-hui.Analysis of the Effects on the Deposition of Electroless Fe-B Film[J].Journal of Hunan University(Naturnal Science),2007,34(1):52-55.
Authors:HUANG Gui-Fang  HUANG Wei-Qing  WANG Ling-ling  ZHU Yi-Cun  WANG Qiao-ling  ZHANG Jian-hui
Institution:1. College of Physics and Microelectronic, Hunan Univ, Changsha,Hunan 410082, China; 2. Changsha Environmental Protection College, Changsha,Hunan 410004, China
Abstract:Fe-B films were prepared by electroless deposition on brass substrate coupled with aluminum from the sulphate bath.The deposition behavior of Fe-B film was investigated by electrochemical and gravimetrical measurements.The results showed that the coupled aluminum shifted the deposition potential negatively and decreased the polarization resistance of reaction,especially that of the reduction reaction.The plating rate depended on the bath component and process parameters.
Keywords:Fe-B alloy  electroless plating  plating rate  coupled Al  electrochemical
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