| 引线框架用Cu-Ni-Si合金的发展及研究现状 |
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| 引用本文： | 张英,陆萌萌,胡艳艳,刘耀,郑少锋.引线框架用Cu-Ni-Si合金的发展及研究现状[J].上海理工大学学报,2014,35(4):177-182. |
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| 作者姓名： | 张英 陆萌萌 胡艳艳 刘耀 郑少锋 |
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| 作者单位： | 江西理工大学 材料科学与工程学院, 江西 赣州 341000;江西理工大学 材料科学与工程学院, 江西 赣州 341000;江西理工大学 材料科学与工程学院, 江西 赣州 341000;江西理工大学 材料科学与工程学院, 江西 赣州 341000;江西理工大学 材料科学与工程学院, 江西 赣州 341000 |
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| 摘 要： | 综述了引线框架用Cu-Ni-Si合金的发展历史,阐述了Cu-Ni-Si合金的强化机制,指出时效强化是该合金的主要强化方式,形变强化和固溶强化在一定程度上影响合金的性能.归纳总结了该合金性能与Ni、Si元素的质量比值、添加微量P、Fe、Mg、Zn、Cr等元素的种类和数量之间的关系,并分析了微量P、Fe、Mg、Zn、Cr等元素对Cu-Ni-Si合金性能改善的机理.指出了Cu-Ni-Si合金是一种很有应用前景的引线框架材料,其强度一般为600～860 MPa,导电率为30～60%IACS.
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| 关 键 词： | Cu-Ni-Si合金 强化机理 引线框架 发展 |
| 收稿时间： | 2013/12/28 0:00:00 |
Development and Study of Cu-Ni-Si Alloy for Lead Frame |
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| ZHANG Ying,LU Meng-meng,HU Yan-yan,LIU Yao and ZHENG Shao-feng.Development and Study of Cu-Ni-Si Alloy for Lead Frame[J].Journal of University of Shanghai For Science and Technology,2014,35(4):177-182. |
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| Authors: | ZHANG Ying LU Meng-meng HU Yan-yan LIU Yao and ZHENG Shao-feng |
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| Institution: | School of Materials Science and Engineering, Jiangxi Univerdity of Science and Technology, Ganzhou 341000, China;School of Materials Science and Engineering, Jiangxi Univerdity of Science and Technology, Ganzhou 341000, China;School of Materials Science and Engineering, Jiangxi Univerdity of Science and Technology, Ganzhou 341000, China;School of Materials Science and Engineering, Jiangxi Univerdity of Science and Technology, Ganzhou 341000, China;School of Materials Science and Engineering, Jiangxi Univerdity of Science and Technology, Ganzhou 341000, China |
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| Abstract: | In the paper,following a review of the history of Cu-Ni-Si lead-frame material,the strengthening mechanism of Cu-Ni-Si alloy has been elaborated.While ageing strengthening is the main strengthening method of the alloy,strain strengthening and solution strengthening affect the performances of the alloy to some extent.Besides,the correlations have been analyzed between the performance of the alloy and the weight ratio of Ni and Si and the type and amount of added alloy elements such as P,Fe,Mg,Zn and Cr that enhance the performance of Cu-Ni-Si alloy.Cu-Ni-Si alloy is a promising lead-frame material with its strength about 600-860 MPa and its conductivity 30-60%IACS. |
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| Keywords: | Cu-Ni-Si alloy strengthening mechanism lead-frame development |
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