高强高导铜基材料研究现状及展望

高强高导铜基材料是一类具有广阔应用前景的功能结构材料,被广泛应用于微电子、电力及机械等工业领域。系统总结了合金化法和复合材料法的基本原理、制备工艺和研究现状,合金化法是传统的高强高导铜基材料的重要制备方法,多元微合金复合化和工艺优化是其发展趋势,复合材料法是高强高导铜基材料的理想强化手段,具有广阔的应用前景,优化工艺和降低成本是其今后研究的重要课题。

Current Status and Development of High-strength and High-conductivity Cu-based Material

High-strength and high-conductivity Cu-based material is a promising functional and struc- tural material, which is widely used in microelectronics, electric power and machinery industries. The basic principle, preparation method and research development of alloying method and composite method are summarized. Alloying method is an important preparation method of traditional high- strength and high-conductivity Cu-based material. Complex Micro-alloying composition and prepara- tion method optimization are the development trend. Composite method has become the ideal strengthening means of high-strength and high-conductivity Cu-based material and has a very good application prospect. Technique optimization and cost reduction are the future directions of research.