钨铜基电镀铝层阳极氧化后的组织和性能研究

采用直流草酸法对镀铝层进行阳极氧化,研究了氧化电压和氧化时间对氧化层表面形貌、组织结构及表面绝缘性的影响。采用金相显微镜对镀铝层和氧化层表面形貌进行观察,扫描电镜和X射线衍射仪分析镀铝层和氧化层的成分与结构,并对其硬度进行测试,探索钨铜箔片上制备氧化铝的最佳工艺。实验现象表明:经过阳极氧化处理后,氧化层表面致密平滑,由非晶Al2O3和Al相组成,电绝缘性能良好;氧化铝膜的硬度随着氧化时间呈现先增加后降低,最后趋于稳定的趋势;而氧化铝膜的硬度随着氧化电压增大而增大。当氧化电压控制在30 V,氧化时间在3-6 h时,最有利于氧化膜的形成,且膜厚呈增大趋势。

Study on Structure and Performance of the AI Coating Surface on W-Cu Substrate after Anodicoxidation Treatment

The anodized dielectric films on the surface of Al coatings after anodicoxidation treatment in ethanedioic acid were reported in this work. Effects of electric voltage and anodic time on surface morphology, structure and surface insulativity of the films were studied. Results showed that, after treatment, the surface particles became flocculent, smooth and a good connection between them. The size of holes on the surface of anodized film increased as anodic time passed, the surface micro-hard-ness was significantly bigger than before, and as time passed, it firstly increased, then decreased, fi-nally stabilized, but the micro-hardness always increased with the electric voltage increasing. The an-odized dielectric film surface had a good insulativity, and when electric voltage was 30 V, the thick-ness of anodized films exhibited a tendency of increasing, which was good for the formation of ano-dized films.