| 玻璃与金属封接过程中气孔率和玻璃飞溅 |
| |
| 引用本文： | 罗大为,沈卓身.玻璃与金属封接过程中气孔率和玻璃飞溅[J].北京科技大学学报,2011(7):856-862. |
| |
| 作者姓名： | 罗大为 沈卓身 |
| |
| 作者单位： | 深圳职业技术学院应用化学与生物技术学院;北京科技大学材料科学与工程学院; |
| |
| 基金项目： | 深圳市科技局资助项目(No.JC201006020768A) |
| |
| 摘 要： | 通过测量不同工艺条件下玻璃绝缘子中的气孔率和最大气泡直径,以及观察底盘表面的玻璃飞溅情况,研究了熔封气氛、熔封温度、熔封时间、氧化膜类型和厚度对玻璃绝缘子中气孔率和玻璃飞溅的影响.结果表明,玻璃绝缘子中气孔率与可伐合金底盘表面的飞溅程度有一定的关系.可伐合金表面Fe3O4氧化物与玻璃中SiO2发生化学反应是玻璃绝缘子中气泡的一个重要来源,也是引起玻璃飞溅的因素.熔封气氛和氧化膜厚度对气孔率和玻璃飞溅影响最大.推荐的工艺条件是在可伐合金表面生成厚度约1μm的FeO氧化膜,然后与玻坯在950～980℃工厂条件的气氛中熔封30～40 min.
|
| 关 键 词： | 可伐合金 玻璃 封接 气孔率 气泡 飞溅 |
Porosity and glass sputtering in the sealing process of glass to metal |
| |
| LUO Da-wei,SHEN Zhuo-shen School of Applied Chemistry , Biotechnology,Shenzhen Polytechnic,Shenzhen ,China School of Materials Science , Engineering,University of Science , Technology Beijing,Beijing ,China.Porosity and glass sputtering in the sealing process of glass to metal[J].Journal of University of Science and Technology Beijing,2011(7):856-862. |
| |
| Authors: | LUO Da-wei SHEN Zhuo-shen School of Applied Chemistry Biotechnology Shenzhen Polytechnic Shenzhen China School of Materials Science Engineering University of Science Technology Beijing Beijing China |
| |
| Institution: | LUO Da-wei1,2),SHEN Zhuo-shen2) 1) School of Applied Chemistry and Biotechnology,Shenzhen Polytechnic,Shenzhen 518055,China 2) School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China |
| |
| Abstract: | The effects of sealing atmosphere,sealing temperature,sealing time,oxides' type and thickness on porosity and glass sputtering were investigated by measuring the porosity and the maximum diameter of gas bubbles in the glass insulator and observing the glass sputtering state on the surface of kovar alloy under various process conditions.It is indicated that there is a relationship between the porosity of the glass insulator and the glass sputtering grade on the surface of Kovar alloy.The chemical reaction be... |
| |
| Keywords: | kovar alloy glass sealing porosity bubbles sputtering |
| 本文献已被 CNKI 等数据库收录！ |
|
