| 非晶态Ni—P合金的再钝化行为 |
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| 引用本文： | 孙冬柏,杨德钧.非晶态Ni—P合金的再钝化行为[J].北京科技大学学报,1992,14(2):239-243. |
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| 作者姓名： | 孙冬柏 杨德钧 |
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| 作者单位： | 北京科技大学表面科学和腐蚀工程系
(孙冬柏，杨德钧)，北京科技大学表面科学和腐蚀工程系(朱日彰) |
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| 摘 要： |
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| 关 键 词： | 非晶态合金 再钝化 化学镀 镍 磷 |
Repossivation Behavior of Amorphous Ni-P Alloy |
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| Sun Dongbai Yang Dejun Zhu Rizhang CDcpt. of Surface Science and Corrosion Engineering.Repossivation Behavior of Amorphous Ni-P Alloy[J].Journal of University of Science and Technology Beijing,1992,14(2):239-243. |
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| Authors: | Sun Dongbai Yang Dejun Zhu Rizhang CDcpt of Surface Science and Corrosion Engineering |
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| Institution: | Sun Dongbai Yang Dejun Zhu Rizhang CDcpt. of Surface Science and Corrosion Engineering |
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| Abstract: | A new set of scratching electrode apparatus has been designed to investigate the repassivation behavior of electroless amorphous Ni-P alloy in 3.5% NaCl solution. The results show that the repassivation kinetics obeys the equation, i (t)=-A1exp (- C1t) + A2 exp (-c2t). In the lower potential, the oxidation of Ni occurs quickly and the stable oxide NiOOH forms on the surface. The oxide film growth follows the ionic conduct mechanism of high electric field. And, in the higher potential, the adsorption process is rapid, and the adsorbed monolayer on the interface makes the bare surface current decrease quickly. The adsorbed anion H2PO2 effectively inhibits the dissolution of Ni site. |
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| Keywords: | amorphous alloy electroless Ni-P repassivation |
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