| SiCp/Al电子封装复合材料预成形坯的制备 |
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| 引用本文： | 平延磊,贾成厂,曲选辉,李志刚.SiCp/Al电子封装复合材料预成形坯的制备[J].北京科技大学学报,2004,26(3):301-303,329. |
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| 作者姓名： | 平延磊 贾成厂 曲选辉 李志刚 |
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| 作者单位： | 北京科技大学材料科学与工程学院,北京,100083 |
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| 基金项目： | 国家自然科学基金
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民口配套项目 |
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| 摘 要： | 在本实验中将SiC颗粒与粘结剂混合,温压制备成坯块,进行了热脱脂与预烧结,研究了热脱脂-预烧结后坯块的线性膨胀率、孔隙度、强度与工艺条件的关系,对预成形坯的显微组织形貌进行分析.结果表明,通过有效地控制成形、脱脂与烧结等工艺参数,能制备出具有适合强度和孔隙度的预成形坯.
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| 关 键 词： | SiCp/Al复合材料 预成形坯 孔隙度 强度 线性膨胀率 SiCp 电子封装 复合材料 预成形坯 Preparation Composite 工艺参数 预烧结 热脱脂 控制 结果 分析 显微组织形貌 关系 工艺条件 强度 孔隙度 线性膨胀率 研究 温压 |
Preparation of SiCp/Al Electronic Packaging Composite Preforms |
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| PING Yanlei,JIA Chengchang,QU Xuanhui,LI Zhigang Materials Science and Engineering School,University of Science and Technology Beijing,Beijing ,China.Preparation of SiCp/Al Electronic Packaging Composite Preforms[J].Journal of University of Science and Technology Beijing,2004,26(3):301-303,329. |
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| Authors: | PING Yanlei JIA Chengchang QU Xuanhui LI Zhigang Materials Science and Engineering School University of Science and Technology Beijing Beijing China |
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| Institution: | PING Yanlei,JIA Chengchang,QU Xuanhui,LI Zhigang Materials Science and Engineering School,University of Science and Technology Beijing,Beijing 100083,China |
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| Abstract: | SiCp and binder were mixed together and SiCp preforms were prepared by warm pressing, thermal
debinding and pre-sintering. The relations of the performances such as size variation, porosity and strength of the
performs with process parameters were investigated. The microstructure of the performs was observed by SEM. The
results show that SiCp preforms with suitable strength and porosity for preparing SiCp/Al composites can be obta-
ined by controlling effectively the process parameters such as compaction, debinding and pre-sintering. |
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| Keywords: | SiCp/Al composite preform porosity strength linear expansion ratio |
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