| 载体金属化镀层对SMT软钎焊接头热循环可靠性的影响 |
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| 引用本文： | 黄继华,钱乙余.载体金属化镀层对SMT软钎焊接头热循环可靠性的影响[J].北京科技大学学报,1993,15(3):293-297. |
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| 作者姓名： | 黄继华 钱乙余 |
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| 作者单位： | 北京科技大学
(黄继华)，哈尔滨工业大学
(钱乙余，姜以宏)，桦林职工橡胶学院(裴佳莹) |
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| 摘 要： |
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| 关 键 词： | 可靠性 表面组装技术 软钎焊接头 |
The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling |
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| Huang Jihua Qian Yiyu Jiang Yihong Pel Jiaying Universily of Science and Technology Beijing Harbin Institute of TechnologyHualin Institute of Rubber Staff.The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling[J].Journal of University of Science and Technology Beijing,1993,15(3):293-297. |
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| Authors: | Huang Jihua Qian Yiyu Jiang Yihong Pel Jiaying Universily of Science and Technology Beijing Harbin Institute of TechnologyHualin Institute of Rubber Staff |
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| Institution: | Huang Jihua Qian Yiyu Jiang Yihong Pel Jiaying Universily of Science and Technology Beijing Harbin Institute of TechnologyHualin Institute of Rubber Staff |
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| Abstract: | An experimental setup and a simulated ceramic chip carrier for study of the SMT solder joint reliability under thermal cycling have been developed. The influence of metal plating of chip carrier on the reliability of the SMT solder joints under thermal cycling has been studied statistically. |
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| Keywords: | SMT thermal cycling intermetallics solder joint reliability metal plating |
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