基于晶圆键合工艺的光刻掩膜版排版方法

晶圆–晶圆键合技术突破了传统晶圆平面工艺, 但键合晶圆的光刻对准图形及其他辅助图形有特殊的位置摆放和形貌绘制要求, 而传统方法进行光刻掩膜版排版费时费力且极易出错。针对该技术挑战, 提出一种与传统排版方式不同的整体翻转式排版方法: 在面对面晶圆–晶圆(两片)产品排版中, 通过“替换–翻转”过程, 可以快速有效地一次性解决辅助图形单元形貌和位置的对应翻转, 大幅度减少键合产品排版的工作量, 降低错误率, 有效地缩短产品导入时间周期。

Floor Plan Arrangement Based on Wafer-To-Wafer Bond Product

Wafer-to-wafer bond technology has breakthrough semiconductor manufacturing from 2D to 3D, but the bonded wafer brings more locating and patterning rules, it is too complex to layout the frame cells by traditional floor plan arrangement. This article provides a new floor plan arrangement method in face-to-face bonding product. It could setup all floor plans at same time only by flipping the motherboard. The new method is introduced. Final result with new method’s benefit is shown based on actually bonding product taping out procedure.