| 金属薄膜──陶瓷基组件热载屈曲失效 |
| |
| 引用本文： | 刘宝琛,童瑞成.金属薄膜──陶瓷基组件热载屈曲失效[J].清华大学学报(自然科学版),1994(2). |
| |
| 作者姓名： | 刘宝琛 童瑞成 |
| |
| 作者单位： | 清华大学工程力学系 |
| |
| 摘 要： | 以康铜、镍不同厚度的薄膜，陶瓷Ａｌ２Ｏ３基组成微电子组件模型，在热载作用下，通过试验观察到薄膜在界面处的分层和屈曲失效。测量了分层和屈曲高度随载荷变化规律、过屈曲初始裂纹扩展。用屈曲理论和分界面能量释放率等理论进行了分析。
|
| 关 键 词： | 薄膜 基 微电子组件 屈曲 界面 |
Buckle-driven delamination of metal film/ceramic substrate systems under thermal loading |
| |
| Liu Baochen,Tong Ruicheng.Buckle-driven delamination of metal film/ceramic substrate systems under thermal loading[J].Journal of Tsinghua University(Science and Technology),1994(2). |
| |
| Authors: | Liu Baochen Tong Ruicheng |
| |
| Abstract: | The film/substrate systems which are made of Ni-Cu,Ni films,Al2O3 ceramic substrate are delaminating and buckling under thermal loading.Backle-driven delamination and their paremeters are measured by microscope.Some results are analyzed. |
| |
| Keywords: | film substrate film/substrate system buckle interface |
| 本文献已被 CNKI 等数据库收录！ |
