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3DSoC的多频测试架构设计
引用本文:刘蓓,汪千松,余雷,陈阳.3DSoC的多频测试架构设计[J].安徽工程科技学院学报,2014(1):66-69,80.
作者姓名:刘蓓  汪千松  余雷  陈阳
作者单位:安徽工程大学现代教育技术中心;
基金项目:安徽省教育厅教研基金资助项目(2012jyxm280、2012jyxm870);高校省级自然科学研究基金资助项目(KJ2012B022);安徽工程大学青年科研基金资助项目(2013YQ32)
摘    要:随着芯片集成度的提高,三维片上系统(three-dimensionalSystemonChip,3DSoC)是集成电路发展的必然趋势,其中可测性设计成为研究的重点.为了降低测试代价,提出一种符合工业实际的多频测试架构及适用于该架构的测试算法,并结合功耗对测试架构进行了仿真实验.实验结果表明,与传统的SoC相比,在同样TAM测试数据位宽数限制下,多频架构的3DSoC测试时间更短,测试代价更小.

关 键 词:三维片上系统  多频测试  测试时间  测试扫描链

Multi-frequency test architecture design on 3D SoC
LIU Bei,WANG Qian-song,YU Lei,CHEN Yang.Multi-frequency test architecture design on 3D SoC[J].Journal of Anhui University of Technology and Science,2014(1):66-69,80.
Authors:LIU Bei  WANG Qian-song  YU Lei  CHEN Yang
Institution:(Modern Educational Technology Center,Anhui Polytechnic University, Wuhu 241000, China)
Abstract:With the improvement of circuit integration, 3D SoC (three-dimensional System on Chip) is a new trend of SoC (System on Chip), and the design for testability of 3D SoC becomes the focus. To re- duce the test cost, a new multi-frequency test architecture is designed and the corresponding algorithm combined with the power consumption is proposed,which is tested on the platform. The experiment re- suits show that the testing time and cost can be less than the traditional SoC with the same test data width of TAM.
Keywords:3D SoC  mult-frequency test ~ test time ~ test scan chain
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