Effects of submicron diamonds on the growth of copper in Cu-diamond co-deposition |
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Authors: | You-yang Wei Wei-ping Li Hui-cong Liu Yong-zheng Liu Li-qun Zhu |
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Institution: | 1.The key Laboratory of the Ministry of Education of China for Aerospace Materials and Performance,Beijing,China;2.School of Materials Science and Engineering,Beihang University,Beijing,China;3.Beijing Institute of Aeronautical Materials,Science and Technology on Advanced Composites Laboratory,Beijing,China |
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Abstract: | Submicron diamonds were co-deposited on aluminum substrates with copper from the acid copper sulfate electrolyte by electrolyte-suspension
co-deposition. After submicron diamonds were added to the electrolyte, the shape of copper grains transformed from oval or
round to polyhedron, the growth mode of copper grains transformed from columnar growth to gradual change in size, and the
preferred orientation of copper grains transformed from (220) to (200). Analyzing the variation of cathodic overpotential,
it was found that the cathodic overpotential tended to remain unchanged when copper plane (220) grew in the process of electrodepositing
pure copper, while it tended to decrease with time when copper plane (200) grew in the process of co-deposition. It was inferred
that copper plane (200) was propitious to the deposition of submicron diamonds. |
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