Mechanical,electrical, and thermal properties of the directionally solidified Bi-Zn-Al ternary eutectic alloy |
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Authors: | M.?ahin E.?adrl |
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Affiliation: | 1. Department of Electronics and Automation, Technical Vocational School of Sciences, Ni?de University, Ni?de 51200, Turkey 2. Department of Physics, Faculty of Arts and Sciences, Ni?de University, Ni?de 51200, Turkey |
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Abstract: | A Bi-2.0Zn-0.2Al (wt%) ternary eutectic alloy was prepared using a vacuum melting furnace and a casting furnace. The samples were directionally solidified upwards at a constant growth rate (V = 18.4 μm/s) under different temperature gradients (G = 1.15–3.44 K/mm) and at a constant temperature gradient (G = 2.66 K/mm) under different growth rates (V = 8.3–500 μm/s) in a Bridgman-type directional solidification furnace. The dependence of microstructure parameter (λ) on the solidification parameters (G and V) and that of the microhardness (Hv) on the microstructure and solidification parameters were investigated. The resistivity (ρ) measurements of the studied alloy were performed using the standard four-point-probe method, and the temperature coefficient of resistivity (α) was calculated from the ρ-T curve. The enthalpy (ΔH) and the specific heat (C p ) values were determined by differential scanning calorimetry analysis. In addition, the thermal conductivities of samples, obtained using the Wiedemann-Franz and Smith-Palmer equations, were compared with the experimental results. The results revealed that, the thermal conductivity values obtained using the Wiedemann-Franz and Smith-Palmer equations for the Bi-2.0Zn-0.2Al (wt%) alloy are in the range of 5.2–6.5 W/Km and 15.2–16.4 W/Km, respectively. |
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Keywords: | ternary eutectic alloys directional solidification microhardness electrical resistivity thermal conductivity |
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