| 陶瓷表面化学镀铜动力学的研究 |
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| 引用本文： | 张颖,陶珍东,安威.陶瓷表面化学镀铜动力学的研究[J].菏泽学院学报,1998(2). |
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| 作者姓名： | 张颖 陶珍东 安威 |
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| 作者单位： | 山东建材学院，山东建材学院，山东建材学院 济南 250022，济南 250022，济南 250022 |
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| 摘 要： | 从化学动力角度对陶瓷表面化学镀铜过程中的反应速率进行了初步探讨,由化学镀铜过程中的反应机理推导了动力学方程式,并根据试验结果计算了有关动力学参数,研究结果证明了陶瓷表面化学镀铜的可行性,所得的动力学方程式对生产实践有一定的指导意义。
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| 关 键 词： | 陶瓷 化学镀铜 动力学参数 |
Study on Kinetics of Cu-plating Chemically on Ceramics Surface |
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| Zhang Ying Tao Zhendong An Wei.Study on Kinetics of Cu-plating Chemically on Ceramics Surface[J].Journal of Heze University,1998(2). |
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| Authors: | Zhang Ying Tao Zhendong An Wei |
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| Abstract: | In this paper, the reaction rate of Cu - plating chemicalliy on ceramics surface was studied from the chemical kinetics aspect. Based on the reaction mechanism of chemical plating process, the kinetics equation was deduced and the related kinetics parameters were calculated by help of the experiment results. The study confirmed availability of Cu - plating chemically on ceramics surface. The attained equation is significant for production. |
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| Keywords: | Ceramics Cu-plating chemically kinetics |
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