电子封装的边界条件独立热阻网络模型的研究

研究倒装陶瓷球栅阵列(flip chip ceramic ball grid array,FC-CBGA)电子封装的边界条件独立热阻网络模型.依据热模型的研究路线图,采用三维有限体积法,建立了详细热模型,所得热阻与模拟冷板实验结果对比的平均误差为3.78%,验证了详细热模型的准确性.在此基础上,建立了FC-CBGA三热阻网络模型,它与详细热模型在加装冷板、热沉、强制对流等21类边界条件下的结温对比误差均小于4%.结果表明,该热阻网络模型具有边界条件独立性,结构更加简单,能快速准确地获取电子封装的结温与热阻,可完全替代详细热模型来分析电子系统的热流路径和热管理.

Boundary-Condition-Independent Resistor Network Thermal Model of Flip Clip Ceramic Ball Grid Array Electronic Package

A boundary-condition-independent resistor network thermal model of flip chip ceramic ball grid array (FC-CBGA) electronic package was investigated. According to the roadmap of the thermal model, a 3-D detailed model of FC-CBGA was set up by a finite volume mathematical method. The average discrepancy of resistance was lower than 3.78% by comparing with experimental results, which verified the availability of the 3-D detailed model. Based on the above results, a three-thermal resistor model of FC-CBGA is presented in this research. The errors of the junction temperature compared between two models are lower than 4% for twenty-one kinds of boundary conditions including cold plate, heat sink and forced convection etc. The results show that the three-thermal resistor model is independent of boundary conditions and much simpler. It can not only simulate precisely the junction temperature and thermal resistance, but also substitute totally for the detailed model to analyze the thermal path and thermal management of electrical systems.