苯乙炔封端含萘环的聚酰亚胺树脂

将二胺单体1,3 双（4 氨基苯氧基）苯（1,3,4-APB）、3,4 二氨基二苯醚（3,4-ODA）分别与3,3′,4,4′-联苯四酸二酐（s-BPDA）和1,4,5,8 萘四甲酸二酐（NTDA）进行缩聚反应，并在两种不同合成条件下合成三种苯乙炔苯酐（PEPA）封端的聚酰亚胺低聚（PI1、PI2、PI3）。结果表明，含六元酸酐环的NTDA与二胺反应不仅形成酰亚胺结构，而且还形成异酰亚胺结构，并且酸性条件下更有利于酰亚胺结构的形成。这三种以苯乙炔苯酐封端的低聚物均具有良好的加工性能和热性能，有很宽的加工窗口，5%热失重温度均5300℃以上。萘环的引入使低聚物固化前后的玻璃化转变温度均有所提高，但也使得低聚物黏度上升。

Phenylethynyl end-capped polyimide resins containing naphthalene units

The synthesis and characterization of phenylethynyl end capped polyimide oligomers, designated PI1, PI2 and PI3, derived from 3,3',4,4' biphenylene dianhydride (s-BPDA), 1,4,5,8-naphthalenetetracarboxylic dianhydride (NTDA), 1,3 bis(4-aminophenoxy)benzene (APB), 3,4-diaminodiphenyl ether (3,4 ODA) and 4 phenylethynylphthalic anhydride (4 PEPA) under different reaction conditions are described. It was found that both naphthalimide and naphthalisoimide structures were formed during condensation of the six membered naphthalene anhydrides with aromatic diamines; the naphthalimide structure was more readily formed under acid conditions. All the polyimide oligomers exhibited good processabilities and excellent thermal properties with large processing windows and high 5% weight loss temperatures (>5300?℃). Although NTDA afforded oligomers with higher Tg than s-BPDA, their processability was slightly inferior.