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热超声倒装芯片运动平台的模糊PID控制
引用本文:周海波,邓华,段吉安.热超声倒装芯片运动平台的模糊PID控制[J].系统仿真学报,2007,19(13):2944-2947,2954.
作者姓名:周海波  邓华  段吉安
作者单位:中南大学机电工程学院,湖南,长沙,410083
基金项目:国家自然科学基金;国家重点基础研究发展计划(973计划)
摘    要:针对自行设计的步进电机结合传动装置构成的热超声倒装芯片运动平台,建立了含摩擦等扰动因素的系统非线性数学模型。针对这一非线性数学模型,研究了传统PID控制和模糊PID控制的控制性能。结果表明,传统PID控制难以达到理想的性能,而模糊PID控制能显著地改善定位精度和运行速度。

关 键 词:芯片键合  运动平台  非线性系统  PID控制  模糊PID控制
文章编号:1004-731X(2007)13-2944-04
收稿时间:2006-05-18
修稿时间:2006-05-182006-09-04

Fuzzy-PID Control for the Motion Platform of Thermosonic Flip-chip Bonding Machines
ZHOU Hai-bo,DENG Hua,DUAN Ji-an.Fuzzy-PID Control for the Motion Platform of Thermosonic Flip-chip Bonding Machines[J].Journal of System Simulation,2007,19(13):2944-2947,2954.
Authors:ZHOU Hai-bo  DENG Hua  DUAN Ji-an
Institution:College of Mechanic and Electrical Engineering, Central South Univerisity, Changsha 410083, China
Abstract:A nonlinear model with friction effects was built for the motion platform of the self-developed thermosonic flip-chip bonding machine. The platform consists of stepper motors and gearings. The control performance of the motion platform was studied by using traditional PID and fuzzy PID based on the nonlinear model. The simulation results show that, it is difficult to achieve desired control performance for traditional PID, and fuzzy PID can significantly improve the positioning accuracy and operating speed of the motion platform.
Keywords:flip-chip bonding  motion platforms  nonlinear systems  PID control  fuzzy-PID control
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