| Sn-20Bi-X无铅焊料的显微组织和物理性能 |
| |
| 引用本文： | 杨石强,雷晓娟,李元山,陈振华.Sn-20Bi-X无铅焊料的显微组织和物理性能[J].湖南大学学报(自然科学版),2007,34(3):49-52. |
| |
| 作者姓名： | 杨石强 雷晓娟 李元山 陈振华 |
| |
| 作者单位： | 1. 湖南大学,材料科学与工程学院,湖南,长沙,410082
2. 国防科技大学,计算机学院,湖南,长沙,410073 |
| |
| 基金项目： | 装备预研项目(51416060204KG0172) |
| |
| 摘 要： | 采用合金化的方法,以Sn-20Bi合金为基础,研究了添加第三组元Ag,ln,Ga或Sb对Sn-Bi合金微观结构、物理性能的影响．结果表明:在Sn-20Bi中加入0．7%的Ag,0．5%的Ga,0．1%的In可使脆硬相Bi细小分散,偏析减少,合金熔化温度降低,获得较好的组织和性能;Sb作为单独的第三组元加入,使Sn-Bi-Sb合金中Bi的偏析较多,硬度有所上升．
|
| 关 键 词： | 焊料 Sn 偏析 物理性能 |
| 文章编号： | 1000-2472（2007）03-0049-04 |
| 修稿时间： | 2006-02-26 |
Microstructure and Physical Properties of Sn - 20Bi-X Lead-Free Solders |
| |
| YANG Shi-qiang,LEI Xiao-juan,LI Yuan-shan,CHEN Zhen-hua.Microstructure and Physical Properties of Sn - 20Bi-X Lead-Free Solders[J].Journal of Hunan University(Naturnal Science),2007,34(3):49-52. |
| |
| Authors: | YANG Shi-qiang LEI Xiao-juan LI Yuan-shan CHEN Zhen-hua |
| |
| Institution: | 1. College of Materials Science and Engineering, Hunan Univ, Changsha,Hunan 410082, China; 2. School of Computer Science, National Defense Univ of Science and Technology, Changsha, Hunan 410073, China |
| |
| Abstract: | Sn-20Bi lead-free solders were studied in alloying method.Adding alloy element Ag,In,Ga or Sb into Sn-20Bi,the influences of the change of Ag,In,Ga or Sb contents on their microstructure and physi- cal properties were investigated.The results showed that,when the content of Ag was 0.7%,Ga was 0.5%, or In was 0.1%,the melting points of the solder reduced correspondingly and the segregation of Bi decreased, and the microstructure and physical properties were better.Sb was not suitably added solely,and the mi- crostructure of Sn-Bi-Sb solder were a little worse than thai of Sb-free alloys,but the hardness increased. |
| |
| Keywords: | solder Sn segregation physical properties |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
| 点击此处可从《湖南大学学报(自然科学版)》浏览原始摘要信息 |
| 点击此处可从《湖南大学学报(自然科学版)》下载免费的PDF全文 |
|
