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阴极电弧离子镀沉积过程的计算机模拟研究
引用本文:张钧,张以朋,高智平.阴极电弧离子镀沉积过程的计算机模拟研究[J].沈阳大学学报,2004,16(6):32-35.
作者姓名:张钧  张以朋  高智平
作者单位:1. 沈阳大学,机械工程学院,辽宁,沈阳,110044
2. 井陉县第一中学,河北,井陉县,050300
摘    要:在近似计算的基础上,对圆柱形真空镀膜室内偏压电场分布进行模拟,描绘了阴极电弧源粒子的蒸发和运动形态,设计了对称的粒子接收屏,讨论了不同带电粒子的相对接收比例,揭示了成分离析效应的影响因素·

关 键 词:阴极电弧离子镀  离子沉积  计算机模拟
文章编号:1008-9225(2004)06-0032-04
修稿时间:2004年9月16日

Deposition Process in Cathodic Arc Ion Plating Through Computer Simulation
ZHANG Jun,ZHANG Yipeng, GAO Zhiping.Deposition Process in Cathodic Arc Ion Plating Through Computer Simulation[J].Journal of Shenyang University,2004,16(6):32-35.
Authors:ZHANG Jun  ZHANG Yipeng  GAO Zhiping
Institution:ZHANG Jun~1,ZHANG Yipeng~1, GAO Zhiping~2
Abstract:Based on a rational approximation, the bias-voltage electric field in cylinder-like vacuum chamber is simulated and the evaporation of metal atoms and the movement characteristics of electrical particles during plating are depicted. Some various symmetrical cylinder-like lateral surfaces for receiving the particle coming from cathodic target have been designed. The changes of compositions of alloy (different particles) at the receiving surface with different target of various compositions under some deposition processes are discussed. The factors that influence the composition segregation effect are revealed.
Keywords:cathodic arc ion plating  ion deposition  computer simulation
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