AgCu28对Be/HR-1不锈钢热静压接头组织性能的影响

以AgCu28合金作为中间层材料,进行Be/HR—I不锈钢热静压扩散连接。利用光学金相、扫描电镜(SEM)、俄歇电子能谱(AES)和X射线衍射仪(XRD)及材料试验机分析了热静压扩散连接接头的显微组织、元素和物相分布以及力学性能,探讨了扩散区成分、组织结构与性能的关系,以及AgCu28合金作为中间层材料的作用。研究表明:采用AgCu28合金作为中间层材料,能够实现Be/HR—I不锈钢的扩散连接,能有效地减少铍、不锈钢间的元素互扩散,减少了Be与Fe和不锈钢中其他合金元素的脆性金属间化合物的大量生成,接头质量较好。

Microstructure and properties of hot pressing bonding on Be/HR-1stainless steel with AgCu28 as interlayer

Be and HR-I stainless steel with AgCu28 as interlayer was diffusion bonded by hot pressing. The microstructure,composition and phase distribution and mechanical properties of the joints were analyzed using optical microscopy, scanning electron microscopy (SEM), scanning auger microspectroy(SAM) ,x-ray diffraction(XRD) and material testing machines, and the relationship between composition and microstructure and properties ,and the effect of interlayer materials AgCu28 alloy was also discussed. The results show that good joint can be obtained using AgCu28 alloy as interlayer materials, because it can reduce the mutual diffusion between beryllium and stainless steel element,the formation of brittle intermetallic compounds between beryllium and stainless steel element are avoided effectively to improve the diffusion bonding strength and properties .