焊料层空洞对IGBT模块温度分布的影响

作为如今新能源发电、电动汽车和智能电网的重要单元，IGBT模块得到越来越广泛的应用，其安全可靠性也受到更多的关注。当前功率绝缘栅双极型晶体管 (IGBT) 器件封装形式主要有焊接式和压接式两种，而其中焊接式发展较成熟，应用较广泛。作为构成IGBT模块的关键单元和实现IGBT模块功能的关键部分，焊料层的可靠性更加显得尤为重要。焊料层的失效形式主要有：空洞扩大、各材料的热膨胀系数不匹配导致的热疲劳，其中焊料层空洞是由于焊接工艺局限性而难以避免的。本文应用多物理场有限元仿真软件COMSOL，建立IGBT模块的三维模型，研究焊料层空洞不同位置、不同大小对IGBT模块芯片最高温度的影响，并研究新型材料Sn-Ag-Cu-0.5Sb较传统焊料层材料Sn-Ag-Cu的优势，仿真结果表明同工况下，焊料为Sn-Ag-Cu-0.5Sb时，芯片温度都比焊料为Sn-Ag-Cu时低一些，显示出较好的焊料性能。

Influence of solder void on temperature distribution of IGBT module

As an important unit of new energy generation, electric vehicles and smart power grid, IGBT modules have been applied more and more widely, and its safety and reliability have been paid more attention. At present, the packaging forms of power insulated gate bipolar transistor (IGBT) devices mainly include welding type and pressing type, among which the welding type is more mature and widely used. As the key unit of IGBT module and the key part of realizing IGBT module function, the reliability of solder layer becomes more important. The failure modes of solder layer mainly include: thermal fatigue caused by the expansion of cavity and the mismatch of thermal expansion coefficient of various materials, among which the solder layer cavity is unavoidable due to the limitation of welding technology. Based on multiple physical field finite element simulation software COMSOL, establish a three-dimensional model of IGBT module.The influence of different position and size of solder void on the maximum temperature of IGBT module chip was studied. And study the advantage of new materials of Sn-Ag-Cu-0.5Sb than traditional solder material Sn-Ag-Cu, the results show that with the same working conditions, When Sn-Ag-Cu-0.5Sb solders, the chip temperature is lower than when Sn - Ag - Cu solder, shows a better performance of solder.