树脂黏度变化对RTM成型工艺的影响

采用黏度计测定不同初始温度下环氧树脂的黏度,通过拟合法建立环氧树脂的工程黏度模型。将黏度模型引入树脂传递模塑( resin transfer molding, RTM)成型树脂流动模拟中,结合PAM-RTM软件模拟不同初始温度下树脂的填充过程,讨论树脂黏度变化对RTM成型过程树脂流动行为的影响。结果表明,随着树脂初始温度的上升,填充时间先降后升,在初始温度为40℃时填充时间最短。树脂黏度变化对大型结构件RTM成型影响显著。

Influence of the viscosity change of resin on the RTM process

The viscosity of epoxy resin was tested by viscometer, and an engineering viscosity model was constructed by the fitting method. In this simulation, the viscosity model was applied to predict the flow process of epoxy resin with different initial temperatures by using PAM-RTM. The influence of the viscosity change of epoxy resin on resin transfer molding ( RTM) was discussed in detail. The results show that the filling time of RTM decreases first and then increases as the initial temperature increases, and the shortest filling time is acquired at 40℃. The viscosity change of epoxy resin has remarkable influence on the RTM of large scale structure.