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SiCf/Ti2AlNb复合材料的界面反应及热稳定性
引用本文:符跃春,韦泽麒,杨丽娜,王玉敏.SiCf/Ti2AlNb复合材料的界面反应及热稳定性[J].东北大学学报(自然科学版),2022,43(8):1105-1112.
作者姓名:符跃春  韦泽麒  杨丽娜  王玉敏
作者单位:(1. 广西大学 资源环境与材料学院, 广西 南宁530004; 2. 中国科学院 金属研究所, 辽宁 沈阳110016)
摘    要:界面反应层是影响SiC纤维(SiCf)增强钛基复合材料力学性能的重要因素,本文研究了SiCf/Ti2AlNb复合材料在热等静压成型以及热暴露过程中的界面反应、界面元素分布规律和界面热稳定性.研究结果表明:SiCf/Ti2AlNb复合材料内部元素扩散形成的界面产物主要为TiC,在热暴露过程中出现了TiSi2和NbSi2相.SiCf/Ti2AlNb复合材料界面反应层的厚度长大符合Arrhenius定律,其界面反应层厚度长大速率随着热暴露温度的升高而增加.界面反应层长大激活能为24.27kJ/mol,界面层长大频率因子为2.80×10-4 m/s1/2.SiCf/Ti2AlNb复合材料界面在700℃及以下温度具备良好的热稳定性.

关 键 词:钛基复合材料  Ti2AlNb  界面反应  元素扩散  热稳定性  
修稿时间:2021-07-19

Interfacial Reaction and Thermal Stability of SiCf/Ti2AlNb Composites
FU Yue-chun,WEI Ze-qi,YANG Li-na,WANG Yu-min.Interfacial Reaction and Thermal Stability of SiCf/Ti2AlNb Composites[J].Journal of Northeastern University(Natural Science),2022,43(8):1105-1112.
Authors:FU Yue-chun  WEI Ze-qi  YANG Li-na  WANG Yu-min
Institution:1. School of Resources, Environment and Materials, Guangxi University, Nanning 530004, China; 2. Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China.
Abstract:The layer of interfacial reaction(IR)is an important influencing factor on mechanical properties of SiC fiber (SiCf) reinforced titanium matrix composites. The interfacial reaction, element distribution at the interface and interfacial thermal stability of SiCf/Ti2AlNb composites during hot isostatic pressing and thermal exposure procedures are studied. The results show that the main IR product in SiCf/Ti2 AlNb composites is TiC, and the TiSi2 and NbSi2 phases are observed during the thermal exposure procedure. The thickness of IR layer in the SiCf/Ti2AlNb composite obeys the Arrhenius law, and the growth rate of IR layer increases with the thermal exposure temperature. The activation energy for the IR layer growth is 24.27kJ/mol, and the frequency factor is 2.80×10-4 m/s1/2. The interface of SiCf/Ti2AlNb composites shows good thermal stability at 700℃ and below.
Keywords:titanium matrix composites  Ti2AlNb  interfacial reaction  element diffusion  thermal stability  
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