采用薄片溶解工艺制造微机械惯性仪表的实验研究

介绍了一种用以制造微机械惯性仪表（包括微陀螺和微加速度计）的微机械体加工方法——体硅溶解薄片法。它包括硅片工艺、玻璃工艺和组合片工艺。整个工艺过程只需单面处理，三次掩膜。硅片工艺包括刻凹槽，深扩散和干法刻蚀三次工艺过程。玻璃上用剥离的方法形成引线和电极的金属层。然后将硅片和玻璃倒接，进行静电键合。最后腐蚀掉硅片背面未掺杂的体硅，从而分离出结构。本文结合微陀螺的具体结构，详细阐述了每一工艺过程的要点，并着重介绍了硅上刻高深宽比槽的技术。该方法形成的结构与衬底不易粘附，成品率高，制造成本低，可形成的结构图形多种多样。

Study on fabrication of micromechanical inertial instruments with bulk silicon dissolved wafer process

This paper describes the bulk silicon dissolved wafer process which has been employed to fabricate the micromechanical inertial instruments. The silicon wafer is firstly processed by recessing, boron diffusing and deep RIE. It is then electrostatically bonded to the glass substrate with electrodes and leads deposited and patterned by a lift off process. Finally, the undoped silicon on the back side is dissolved away leaving the heavily doped structure attached to the glass substrate. The key points of every step are presented and the etching technique of high aspect ratio trenches is introduced in detail. The SEM photographs of fabricated prototypes of the microdevices are also given. Because of such features as simplicity, low cost and high yield, it can be used to fabricate a wide variety of sensors and actuators.