纯钛TA1和钛合金TC4表面固体渗硼

采用固体粉末法分别对基体组织为α-Ti的TA1和基体组织为(α+β)-Ti的TC4钛合金表面进行了渗硼，在偏光显微镜和扫描电镜(SEM)下观察了渗层的形貌，用X射线衍射(XRD)分析了渗层的物相组成.实验结果表明，渗硼温度在850~1000℃范围内，TA1表面渗层为平行于基体表面的多层结构，为Ti3O相和TiB相;当渗硼温度高于920℃时TiB为主要组成并出现了TiB2相，且硼钛化合物的含量随温度升高而增加.当渗硼温度低于1000℃时，TC4表面渗层为Ti3O相和TiB相，在渗硼温度高于1000℃时，渗层为TiB2+TiB晶须结构.渗硼温度高于1000℃是TA1和TC4表面形成硼钛化合物的充分条件.

Solid Boronizing on the Surface of Pure Titanium TA1 and Titanium Alloy TC4

The solid powder boronizing， on the surface of titanium alloys with matrix structure α Ti of TA1 and(α+β) Ti of TC4， was investigated. The morphology of boride layer was observed by polarizing microscope and scanning electron microscope(SEM). The phase composition of boride layer was analyzed by X ray diffraction(XRD). The results show that when boronizing temperature is in the range of 850~1000℃， diffusion layers on TA1 in a multilayer structure are paralleled to the surface of the substrate， which composes of Ti3O and TiB phases. When the temperature is higher than 920℃， TiB becomes the major component in the diffusion layer with TiB2， and the content of titanium borides increases with temperature. When the temperature is lower than 1000℃， Ti3O and TiB are the major components of the layer on TC4. When it is higher than 1000℃， the layer is TiB2 and TiB whisker. Boronizing temperature above 1000℃ is the sufficient condition for the formation of titanium borides.