焦磷酸盐直接镀铜的研究

<正> 前言焦磷酸盐镀铜,较之氰化工艺具有无毒,电解液稳定,平整性能好,维护方便,维持费用低等优点;而且,电流效率接近100％,电解液分散能力也接近氰化物。在美国是从一九四一年开始在工业生产中应用的,我国也自一九五八年开始了这方面的研究和应用,焦盐工艺是目前无氰镀铜工艺中应用较广的镀种.文献认为:“焦磷酸盐电解液有许多独到之特点,作为取代氰化物及弥补氰化物电解液缺点最有希望”〔1〕。英、俄、日等文献也认为作为取代氰化物具有实际意义的只是焦磷酸盐电解液〔2—4〕。同时文献也认为:“无氰镀铜虽然已在工业中获得应用,但是,当前普遍存在的问题是镀层与钢铁基体金属结合强度很差”。“迅速地有效地解决结合强度问题,仍是无氰镀铜的关

A study of direct copper-plating on steel from Pyrophosphate Bath

A simple method for the direct copper-plating on steel from Pyrophosphate bath has been studied. For the purpose of direct copper-plating, the steel should be immersed in olkali to passivate its surface before plating.During the electrodeposities the cathodic initial current density must be exactly controlled.On the adherence,we have obtained a satisfactory result with this method in industrial production. The possibility of direct plating is based on the Conception of the Cathodic Potential Activation which is proposed by author.The Cathodic Activation Potential bas been determined by chronopotentiometric method at constant current intensity This method presents a new technology for the direct copper-plating on steel from noncyanide bath.