TSCR工艺参数对Fe-3%Si钢带显微组织的影响

在实验室模拟薄板坯连铸连轧(TSCR)生产Fe-3%Si钢带,研究薄板坯连铸连轧不同工艺参数对Fe-3%Si钢带热轧和常化显微组织的影响.结果表明,TSCR工艺生产的Fe-3%Si钢带热轧显微组织沿板厚方向呈现组织不均匀性,1 200℃保温20 min,前两道压下量较大、道次递减的显微组织过渡层再结晶晶粒数较多且相对均匀细小,没有中心层拉长的条带组织,有利于二次再结晶的完善.显微组织平均晶粒尺寸与传统流程热轧平均晶粒尺寸相差1.5μm,具有几乎相同的位错形貌,头部和中部显微组织差别都很小.热轧显微组织质量决定了常化后显微组织的质量.

Effect of TSCR Parameters on Microstructure of Fe-3%Si Strip

TSCR (thin slab casting and rolling) simulation was conducted for the Fe-3% Si strip to investigate the effects of different TSCR parameters on its hot rolling process and normalized microstructure. The results showed that the cross-sectional microstructure is inhomogeneous. When the specimen is rolled after 1200°C for 20 min insulation and under the first two heavier pass reductions and pass reductions decreasing, as a result, the microstructure shows more recrystallized grains which are homogeneously distributed and finer in transition layer with no lengthened band structure found in middle layer. Such a microstructure is advantageous to secondary recrystallization. Compared with the strip by conventional hot rolling process, the average grain size is 1.5 μm bigger, and the dislocation arrangement and the top and middle microstructure look similar. It is important that the microstructure of the hot-rolled strip makes sure of that after normalization.