纳米掺杂Ag/SnO2触头材料的制备及电弧侵蚀性能研究

以CuO和La2O3为掺杂剂,采用高能球磨法制备掺杂纳米SnO2粉体,再采用热挤压工艺制成银含量88%的纳米掺杂Ag/SnO2触头材料,利用扫描电子显微镜、电导率测试仪、显微硬度计对该触头材料进行了微观组织表征及性能测试,随后,利用该触头材料在10A交流电流条件下进行电弧侵蚀性能测试.结果表明,触头材料中氧化物在银基体上分布均匀;Ag/SnO2触头材料的密度、硬度和电导率分别为9.704 1g/cm^3,104.2和75;电弧烧蚀速率为103.65μg/C,并研究了熔层表面的微观组织结构.

Preparation and arc erosion morphology of nano doping Ag/SnO2 contact materials

By high energy ball milling process,the doped nano-stannic anhydride（SnO2）powder was prepared with SnO2 as raw material,CuO and La2O3 as the doping agents.Then,the contact material,nano doped Ag/SnO2 with silver content 88% were prepared by the hot extrusion process.Furthermore,the microstructures of the three materials above were characterized by scanning electron microscopy,the conductivities,hardnesses of the contact materials were measured by the conductivity meter,the microhardness option and arc eroion test was tested under 10 AAC current.The properties data shows that the density,hardness and electrical conductivity of the Ag/SnO2 contact material are 9.704 1g/cm^3,104.2and 75,the arc erosion rate are 103.65μg/C,the microstructure of the erosion surface is also analyzed.