轻质含硅芳炔隔热材料的制备与性能

采用中空玻璃微球(hollow glass microspheres,HGM)、短切石英纤维(short-cut quartz fibers,SQF)和耐热含硅芳炔树脂(Si-containing arylacetylene resin,PSA)制备了HGM/PSA复合物以及SQF/HGM/PSA复合材料,并研究了两者力学性能以及热学性能。研究结果表明:HGM能很好地降低HGM/PSA复合物的密度和导热系数,当HGM质量分数超过30%时,HGM/PSA复合物的导热系数和力学性能迅速下降;随着SQF质量分数的增加,SQF/HGM/PSA复合材料的压缩强度和拉伸强度提升,但密度和导热系数也增加;添加经KH 560表面处理的HGM可提升HGM/PSA复合物以及SQF/HGM/PSA复合材料的力学性能,且对两者的密度和导热系数影响不大;当SQF的质量分数为16%且HGM经KH 560表明处理后,SQF/HGM/PSA复合材料的压缩强度达到96.3 MPa,拉伸强度达到12.3 MPa,同时密度为0.82 g/cm^3,导热系数为0.195 W/(m·K),且在50~490℃通过动态热机械分析仪观察到复合材料没有明显的玻璃化转变。

Preparation and Properties of Lightweight Si-Containing Arylacetylene Composites with Thermal Insulation

Hollow glass microspheres(HGM),short-cut quartz fibers(SQF)and heat resistant Si-containing arylacetylene resin(PSA)were used to prepare HGM/PSA and SQF/HGM/PSA composites,and their mechanical and thermal performance were studied.The results show that HGM can reduce the density and thermal conductivity of HGM/PSA composites,and when the mass fraction of HGM is over 30%,the thermal conductivity and mechanical properties decrease rapidly.With the mass fraction of SQF increasing,the compressive strength and tensile strength of SQF/HGM/PSA composites will be improved,but the density and thermal conductivity also increase.HGM treated with KH 560 can improve the mechanical properties of composites while with little effect on density and thermal conductivity.When the mass fraction of SQF is 16% and the HGM is treated by KH 560,the compressive strength of the SQF/HGM/PSA composites reaches 96.3 MPa and the tensile strength is 12.3 MPa,with the density of 0.82 g/cm 3 and the thermal conductivity of 0.195 W/(m·K).There is no glass transition observed through dynamic thermomechanical analysis machine at 50490°C.