Al-Mn-Si-X合金的再结晶行为研究

对Al-Mn-Si-X合金进行不同温度和不同时间的退火，采用金相显微镜（OM）、扫描电子显微（SEM）和电导率仪对不同状态的合金组织进行观察、能谱（EDS）分析和电导率测试，研究Al-Mn-Si-X合金的再结晶行为.结果表明：随着退火温度的升高，再结晶晶粒尺寸越来越小.Al-Mn-Si-X合金的再结晶晶粒大小主要受再结晶形核数量的影响，再结晶后期的晶粒长大现象不明显.Al-Mn-Si-X合金存在着大量细小弥散的AlMnSi/AlMnSiFe析出相，这些析出相强烈抑制了再结晶形核和再结晶后期的晶粒长大.当退火温度低时，形核激活能较大，形核率低，再结晶晶粒粗大；当退火温度高时，形核激活能较小，形核率增加，再结晶晶粒细小.

Study on Recrystallization Behavior of Al-Mn-Si-X Alloy

In this paper,the recrystallization behavior of Al-Mn-Si-X alloy was investigated,such as microstructure,EDS composition and electrical conductivity,which were characterized respectively by metallographic microscopy(OM),scanning electron microscope(SEM) and electrical conductivity equipment after annealing at different temperature and time.It is found that the size of recrystallization grains will become smaller and smaller with the temperature increase gradually.The size of the recrystallization grains of Al-Mn-Si-X alloy is mainly affected by the number of recrystallization nucleation.After that,fully recrystallized the size of grains remains constant.We also found that a large amount of fine and dispersed AlMnSi/AlMnSiFe precipitates existing in the Al-Mn-Si-X alloy can strongly inhibit both recrystallization nucleation and grain growth in the later complete recrystallization.At low annealing temperature,recrystallization had low nucleation rate and coarse grains due to it requires relatively high activation energy of nucleation.On the other hand,the high annealing temperature can attain higher nucleation rate and fine recrystallization grains due to the lower activation energy.