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Cu-Al异种材料的感应加热焊接及其工艺研究
引用本文:王冰,刘平,刘新宽,王子延,王艳艳,陈小红,刘小稚. Cu-Al异种材料的感应加热焊接及其工艺研究[J]. 上海理工大学学报, 2017, 38(4): 187-192
作者姓名:王冰  刘平  刘新宽  王子延  王艳艳  陈小红  刘小稚
作者单位:上海理工大学 材料科学与工程学院, 上海 200093,上海理工大学 材料科学与工程学院, 上海 200093,上海理工大学 材料科学与工程学院, 上海 200093,亚仕龙汽车科技(上海)有限公司, 上海 200433,上海理工大学 材料科学与工程学院, 上海 200093,上海理工大学 材料科学与工程学院, 上海 200093,亚仕龙汽车科技(上海)有限公司, 上海 200433
基金项目:国家自然科学基金资助项目(51201107)
摘    要:利用感应加热原理,使用功率为0~60 kW且连续可调的高频感应加热设备,完成Cu-Al合金板材的焊接,研究焊接件的界面形貌、元素分布及界面物相分析.分析加热电流和加热时间对界面形貌和结合强度的影响.采用ZWICK-Z050电子万能材料试验机测试界面结合强度,采用扫描电子显微镜和偏光显微镜观察界面形貌,用X射线衍射仪进行物相分析.结果表明:界面中间化合物主要为Al2Cu,Cu9Al4和CuAl相,其中Cu侧主要是Cu9Al4和CuAl相,Al侧主要是Al2Cu相;随着加热电流的增大或加热时间的延长,Cu-Al界面结合层由不平整变为平整,且宽度逐渐增大,同时Cu-Al界面结合强度先增大后减小.感应加热焊接试样界面结合强度可达53 MPa,结合良好.

关 键 词:Cu-Al异种材料  感应加热  焊接  结合层  结合强度
收稿时间:2016-12-17

Induction Heating Welding and Process Investigation of Cu-Al Dissimilar Materials
WANG Bing,LIU Ping,LIU Xinkuan,WANG Ziyan,WANG Yanyan,CHEN Xiaohong and LIU Xiaozhi. Induction Heating Welding and Process Investigation of Cu-Al Dissimilar Materials[J]. Journal of University of Shanghai For Science and Technology, 2017, 38(4): 187-192
Authors:WANG Bing  LIU Ping  LIU Xinkuan  WANG Ziyan  WANG Yanyan  CHEN Xiaohong  LIU Xiaozhi
Affiliation:School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China,School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China,School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China,ASL Automobiles Science & Technology(Shanghai) Co., Ltd., Shanghai 200433, China,School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China,School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China and ASL Automobiles Science & Technology(Shanghai) Co., Ltd., Shanghai 200433, China
Abstract:Taking advantage of the induction heating principle,a high-frequency induction heating equipment with power of 0-60 kW and continuously adjustable was used to weld copper-aluminum plate.Interface microstructure,elemental distribution and phase analysis of the welded assembly were studied.The effects of heating current and heating time on interfacial microstructures and bonding strength were analyzed.The bond strength was measured by ZWICK-Z050 electronic universal testing machine.The microstructures of interfaces were observed by scanning electron microscope and polarizing microscope.The phases were determined by X-ray diffraction.The results indicated that the intermediate compounds at the interface were mainly Al2Cu,Cu9Al4 and CuAl.Cu9Al4 and CuAl phases were mainly on Cu side,while Al2Cu phase was chiefly on Al side.With the increase of heating current or heating time,the bonding layer of Cu-Al interface became smoother and wider.At the same time,the bonding strength of Cu-Al interface increased first and then decreased.Bonding strength of the sample welded by induction heating method could reach 53 MPa.
Keywords:Cu-Al dissimilar material  induction heating  welding  bonding layer  bonding strength
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