| 大功率LED封装散热关键问题的仿真 |
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| 引用本文： | 李爱玉,朱文章.大功率LED封装散热关键问题的仿真[J].厦门理工学院学报,2011,19(4):10-13,22. |
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| 作者姓名： | 李爱玉 朱文章 |
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| 作者单位： | 厦门理工学院数理系,福建厦门,361024 |
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| 基金项目： | 国家自然科学基金项目，厦门市科技计划项目 |
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| 摘 要： | 基于ANSYS有限元软件对目前3种典型LED封装结构的温度场进行模拟分析.通过比较得出,优化封装结构可以有效地提高LED散热性能,途径最佳的是减少热沉数量,次之为降低热沉热阻;经与热对流方式对LED散热效果比较,发现优化封装结构降低结温的效果并不明显.而在可实现的光转换效率下,经过必要的选材优化后,强制对流是最有效解决散热的方法.
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| 关 键 词： | 大功率LED 散热 封装结构 有限元 对流 |
Key Factors in Cooling of High-power LED Packages |
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| LI Ai-yu,ZHU Wen-zhang.Key Factors in Cooling of High-power LED Packages[J].Journal of Xiamen University of Technology,2011,19(4):10-13,22. |
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| Authors: | LI Ai-yu ZHU Wen-zhang |
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| Institution: | 1. Faculty of Mathematics and Physics, Xiamen University of Technology, Xiamen 361024, China; 2. Opto-electrical Engineering Research Center, Xiamen University of Technology, Xiamen 361024, China) |
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| Abstract: | Using the ANSYS software based on the finite-element method, the heat distribution of the LED in three different package structures are simulated and compared, and the effect of the different package structure on the ability of high power LED cooling capacity is analyzed. The effect of the air convection on the cooling for the LED package is also presented. It shows that forced cooling is the key to solve the LED cooling problem. |
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| Keywords: | high power LED heat dissipation packages structure finite element convection |
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