| A planar parallel manipulator based novel MEMS device bonding system |
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| 引用本文： | 纪军红 Sun Lining Zhu Yuhong. A planar parallel manipulator based novel MEMS device bonding system[J]. 高技术通讯(英文版), 2006, 12(4): 351-357 |
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| 作者姓名： | 纪军红 Sun Lining Zhu Yuhong |
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| 作者单位： | Robotics Institute, Harbin Institute of Technology, Harbin 150080, P.R.China |
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| 基金项目： | 国家高技术研究发展计划(863计划) , 国家自然科学基金 |
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| 摘 要： | A novel MEMS device boning system is presented. Aiming at the high velocity, high precision and high flexibility requirements, a novel manipulator of planar parallel structure is developed to substitute ordinary X-Y table. In addition, the machine vision is implemented to improve the system＇ s flexibility. The initial angular positions of the joints are estimated by the extended Kalman filter algorithm. As a resuh, the manipulator＇s absolute locating accuracy in its workspace is guaranteed indirectly. For any MEMS device, the bonding system itself can be used as measurement equipment to create the device＇ s geometry model, which is the base to do off-line programming. A quite ideal trade-off between the system＇ s flexibility and efficiency is got. Finally, some verified motion specification of the manipulator, the bonding experimental results and the verified qualities of the bonded devices are provided.
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| 关 键 词： | 平面平行机械手 微电子机械系统 组装技术 引线连接 卡尔曼滤波 |
| 收稿时间： | 2005-07-26 |
A planar parallel manipulator based novel MEMS device bonding system |
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| Ji Junhong,Sun Lining,Zhu Yuhong. A planar parallel manipulator based novel MEMS device bonding system[J]. High Technology Letters, 2006, 12(4): 351-357 |
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| Authors: | Ji Junhong Sun Lining Zhu Yuhong |
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| Abstract: | A novel MEMS device boning system is presented. Aiming at the high velocity, high precision and high flexibility requirements, a novel manipulator of planar parallel structure is developed to substitute ordinary X-Y table. In addition, the machine vision is implemented to improve the system's flexibility. The initial angular positions of the joints are estimated by the extended Kalman filter algorithm. As a result, the manipulator's absolute locating accuracy in its workspace is guaranteed indirectly. For any MEMS device, the bonding system itself can be used as measurement equipment to create the device's geometry model, which is the base to do off-line programming. A quite ideal trade-off between the system's flexibility and efficiency is got. Finally, some verified motion specification of the manipulator, the bonding experimental results and the verified qualities of the bonded devices are provided. |
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| Keywords: | MicroElectroMechanical Systems lead bonding kalman filtering parameter estimation |
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