| 陶瓷球栅阵列封装的有限元模拟与焊点应力分析 |
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| 引用本文： | 陈云,徐晨.陶瓷球栅阵列封装的有限元模拟与焊点应力分析[J].南通大学学报(自然科学版),2006,5(4):63-66. |
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| 作者姓名： | 陈云 徐晨 |
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| 作者单位： | 1. 东南大学,集成电路学院,江苏,南京,210096
2. 南通大学,电子信息学院,江苏,南通,226007 |
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| 摘 要： | 文章运用有限元分析软件ANSYS,建立了陶瓷球栅阵列(CBGA)封装的三维有限元模型,模拟出热载荷作用下CBGA封装的三维热应力应变分布,研究了焊点的形状对焊点的应力、应变的影响,为在实际焊接过程中,从焊点形态的角度去控制焊点质量提供了理论依据.
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| 关 键 词： | 陶瓷球栅阵列 有限元分析 ANSYS 焊点 应力 |
| 文章编号： | 1673-2340（2006）04-0063-04 |
| 收稿时间： | 2006-06-26 |
| 修稿时间： | 2006年6月26日 |
Construction of a Three-dimensional FEA Model of CBGA and Simulation of the Three-dimensional Stress and Strain of Weld |
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| Authors: | CHEN Yun XU Chen |
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| Abstract: | In this paper,with finite element analysis(FEA) soft ANSYS,a 3-dimensional FEA model of CBGA was built,with which the 3-dimensional stress and strain of CBGA was simulated under the effect of temperature.Besides,some submodels of weld were constructed to analyze the effect of the weld's shape on its stress and strain.The paper provides some theoretical implications to control the weld's quality in terms of its shape. |
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| Keywords: | CBGA finite element analysis ANSYS weld stress |
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