掺杂钨丝再结晶机理的研究

本文用纯钨丝作对比,利用扫描电镜和透射电镜系统地观察了直径0.28mm掺杂钨丝退火后的显微组织变化过程,测量了再结晶温度、显微硬度、亚晶尺寸和位错密度。结果表明:掺杂钨丝退火时由于成串钾泡的形成,发生了回复、原位再结晶和第二次再结晶;第二次再结晶驱动力为界面能和残留的冷变形贮能。

STUDY ON THE MECHANISM OF RECRYSTALLIZATION IN DOPED TUNGSTEN

The microstructure change in doped tungsten wire with a diameter of 0.28 mm is systematically examined by SEM and TEM, in contrast with pure tungsten wire with the same diameter. Recrystallization temperature, microhardness, subgrain size and dislocation density are measured. Experimental results show that recovery, recrystallization in-situ and the second recrystallization occur in doped tungsten wire, due to the formation of K-filled bubbles in row. The second rec- rystallization in doped tungsten wire is a special recrystallization process which is different from both usual primary recrystallization and usual secondary recrystalli- zation. It has been found that the driving force of the second recrystallization consists of both grain boundary energy and retained deformation energy.