| 配位离子在化学镀镍中的动态演变和作用 |
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| 引用本文： | 陈黄浦,宗瑜瑾.配位离子在化学镀镍中的动态演变和作用[J].西安交通大学学报,2000,34(10):57-61. |
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| 作者姓名： | 陈黄浦 宗瑜瑾 |
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| 作者单位： | 西安交通大学,710049,西安 |
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| 基金项目： | 西安交通大学科研基金资助项目!(98002) |
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| 摘 要： | 根据化学热力学原理和配合物化学理论，研究了在化学镀镍溶液中，配位离子在沉积过程中的动态深变及沉积行为。研究结果表明，化学自沉积的沉积速率和溶液的稳定性取决于配位镍离子的物种结构、分布函数关系及其在沉积过程中的动态演变。实验发现，足够的自由镍离子能够保证较高的沉积速率，而在化学镀镍溶液中，同浓度的部分配位镍离子在沉积过程中脱掉配位基壳后，仍能维持深液中自由镍离子的动态热力学平衡，这是既保持高的沉积速
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| 关 键 词： | 化学镀镍 配合物化学 配位离子 电镀 |
Thermodynamic Calculation of Nickel Complex in Electroless Nickel Solutions during Plating |
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| Chen Huangpu,Zong Yujin.Thermodynamic Calculation of Nickel Complex in Electroless Nickel Solutions during Plating[J].Journal of Xi'an Jiaotong University,2000,34(10):57-61. |
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| Authors: | Chen Huangpu Zong Yujin |
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| Abstract: | The theories of coordination chemistry and thermodynamic calculation, are applied to investigate the dynamic speciation and deposition behavior of the nickel complex in the electroless nickel solution during plating.The plating rate and solution stability are dependent upon the structure and speciation of the nickel complex as well as their dynamic evolution. Although higher deposition rate reguires sufficient free nickel ion, it is necessary for the ionic nickel chelate to shed its ligands to form free nickel ion such that thermodynamic equilibrium of free nickel could be kept in the solution during plating.This guarantees not only a higher deposition rate but also the solution stability. |
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| Keywords: | electroless nickel plating coordination chemistry complex ion thermodynamic equilibrium |
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