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基于电磁兼容技术的多层PCB布线设计
引用本文:李翠花,吴疆. 基于电磁兼容技术的多层PCB布线设计[J]. 合肥学院学报(自然科学版), 2007, 17(3): 19-21
作者姓名:李翠花  吴疆
作者单位:合肥学院,基础教学部,合肥,230022;合肥海尔信息产品有限公司,开发部,合肥,230601
摘    要:
随着现代电子技术的发展以及芯片的高速化和集成化,各种电子设备系统内外的电磁环境更加复杂,因此在印制电路板的电路设计阶段考虑电磁兼容性(EMC)设计是非常重要的.以12层板为例讨论了多层PCB分层方法、布线的规则、地线和电源线布置以及电磁兼容性.

关 键 词:电磁兼容  多层印刷电路板  布线  接地
文章编号:1673-162X(2007)03-0019-03
修稿时间:2007-04-17

Design of Multilayer Printed Circuit Board Based on the Electro-magnetic Compatibility
LI Cui-hua,WU Jiang. Design of Multilayer Printed Circuit Board Based on the Electro-magnetic Compatibility[J]. Journal of Hefei University(Natural Sciences Edition), 2007, 17(3): 19-21
Authors:LI Cui-hua  WU Jiang
Abstract:
With development of electronic technique and chip integration,electro-magnetic environment of multi-eletronic equipment is more and more complicated so as in the design of the Printed Circuit Board. It is very important to take electro-magnetic compatibility into account.This paper discusses the electro-magnetic compatibility of the multilayer Printed Circuit Board,through delimitation and regulation of the singal line,electronic source line and grounding line.
Keywords:electro magnetic compatibility  multilayer printed circuit board  design  grounding
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