| 温度与镀层对Sn0.7Cu焊料合金润湿性的影响 |
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| 引用本文： | 赵玉萍,霍飞.温度与镀层对Sn0.7Cu焊料合金润湿性的影响[J].上海理工大学学报,2015,36(2):65-70. |
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| 作者姓名： | 赵玉萍 霍飞 |
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| 作者单位： | 通标标准技术服务(上海)有限公司, 上海 200233;通标标准技术服务(上海)有限公司, 上海 200233 |
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| 摘 要： | 主要研究了真空状态下,焊接温度为530,560和590 K时,Sn-0.7Cu焊料合金在镀Cu、镀Ni、镀Ni/Ag和镀Ni/Au基板上的润湿性.结果表明:提高钎焊时的焊接温度,有助于降低液态Sn-0.7Cu焊料合金的表面张力,从而增大Sn-0.7Cu焊料合金在焊接基板上的润湿性.在相同的焊接条件下,Sn-0.7Cu焊料合金在镀Ni/Ag和镀Ni/Au基板上的润湿性比其在Cu和镀Ni基板上的润湿性好.
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| 关 键 词： | Sn-0.7Cu焊料合金 表面张力 润湿性 |
| 收稿时间： | 2014/12/13 0:00:00 |
Wetting of Sn-0.7Cu Solder Alloy on Different Substrates at Different Temperatures |
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| ZHAO Yuping and HUO Fei.Wetting of Sn-0.7Cu Solder Alloy on Different Substrates at Different Temperatures[J].Journal of University of Shanghai For Science and Technology,2015,36(2):65-70. |
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| Authors: | ZHAO Yuping and HUO Fei |
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| Institution: | SGS-CSTC Standards Technical Services(Shanghai) Co., Ltd., Shanghai 200233, China;SGS-CSTC Standards Technical Services(Shanghai) Co., Ltd., Shanghai 200233, China |
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| Abstract: | In this paper,the wettability of Sn-0.7Cu solder alloy was investigated on different substrates(Cu,Cu/Ni,Cu/Ni/Au and Cu/Ni/Ag)at different temperatures(530 K,560 K and 590 K respectively).The results show that the wettability of Sn-0.7Cu solder alloy improved due to the increase of reflowing temperature which decreased surface tension of molten Sn-0.7Cu alloy.In addition,in the same soldering conditions Sn-0.7Cu solder alloy had better wettability on Cu/Ni/Au and Cu/Ni/Ag substrates than that on Cu and Cu/Ni substrates. |
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| Keywords: | Sn-0 7Cu solder alloy surface tension wettability |
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