| 三价铬镀层强化及结合机理 |
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| 引用本文： | 杜则裕,喻群,陈延青. 三价铬镀层强化及结合机理[J]. 天津大学学报(自然科学与工程技术版), 1994, 0(3) |
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| 作者姓名： | 杜则裕 喻群 陈延青 |
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| 基金项目： | 高等学校博士学科点专项科研基金 |
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| 摘 要： | 研究直流与脉冲两种电源条件下三价铬溶液电刷镀工艺性能．应用Ｘ射线衍射仪等仪器测定了镀层的截面组织、镀层与基体的结合强度、镀层的内应力以及镀层的硬度，并在测试结果的基础上探讨了镀层的结合与强化机理．研究表明：镀层强化归因于镀层内晶粒极其细小造成的强化以及镀层内应力造成的强化；镀层与基体的结合方式有：机械连接、接近原子尺寸的连接和扩散连接．这些结合方式存在于基体与镀层结合面的不同部位并促成镀层与基体结合良好．
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| 关 键 词： | 电刷镀，三价铬，结合机理，强化机理 |
RESEARCH ON BOND AND HARDENING MECHANISM OF TRIVALENT Cr LAYER |
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| Du Zeyu,Yu Qun,Chen Yanqing. RESEARCH ON BOND AND HARDENING MECHANISM OF TRIVALENT Cr LAYER[J]. Journal of Tianjin University(Science and Technology), 1994, 0(3) |
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| Authors: | Du Zeyu Yu Qun Chen Yanqing |
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| Affiliation: | Dept.of Mechanical Engineering |
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| Abstract: | This paper describes the brush-plating of trivalent Cr on direct current andpulse current. The layers so obtained are compared in terms of their morphology of the section,bond intensity of the layer, hardness and internal stress with X ray diffractometers and biber instruments.On the basis of the results the bond and hardening mechanism are studied.Studiesshow that the hardening of the layer lies in the hardening of the extra-fine-grans in the layer andthe hardening caused by the internal stress in the layer.The different types of bond-mechanicalbond,atomic-size bond,and diffuse bond-at different places of the interface are the factors ofthe good bonding of the layers and the base metal. |
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| Keywords: | brush-plating trivalent Cr bond mechanism hardening mechanism |
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