应用于微结构制造自治系统的第Ⅱ类工艺缺陷诊断

集成电路制造过程结束后,对所关心的电特性参数进行测试,测试结果不可避免地存在着或大或小的波动起伏。电学参数方面的过大波动将带来成品率极大下降,造成第II类工艺故障。本文通过一个实例,详细地介绍了一个用于第II类工艺故障诊断的通用性方法。在对诊断实例进行详细分析的基础上,对于诊断方法本身的特点进行了进一步的讨论。基于正交变换的技术,可以将PCM测试参数转化为一组统计不相关的广义参数,作者特别注意到若干广义参数,它们在所有样本点上的测试值保持为常数。本文结束于对不变参数的初步讨论。

The Method Diagnosing Class Ⅱ Process Failures in an Electronic Manufacturing Automation System

After IC fabricating process has finished,the PCM(Process Control Module) parameters are tested.Variances can inevitably be found in the tested data.Big variances in parameters may lead to yield dropping.Such process errors are called class II process failures.A practical example is discussed in detail to describe a novel way for class II process failure diagnosing.Then the advantages of this way over traditional method are introduced.Basing on orthogonalizting,PCM parameters may be transferred into a set of statistically independent generalized parameters.Some generalized parameters keep constants at 110 testing points.Such stationary parameters are discussed as an end of the paper.