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| 半导体激光软钎焊Sn-Ag-Cu焊点微观组织 | |
| 引用本文： | 韩宗杰,鞠金龙,薛松柏,方典松,王俭辛,姚立华.半导体激光软钎焊Sn-Ag-Cu焊点微观组织[J].中南大学学报(自然科学版),2006,37(2):229-234. |
| 作者姓名： | 韩宗杰 鞠金龙 薛松柏 方典松 王俭辛 姚立华 |
| 作者单位： | 1. 南京航空航天大学,材料科学与技术学院,江苏,南京,210016 2. 南京航空航天大学,自动化学院,江苏,南京,210016 3. 南京航空航天大学,经济与管理学院,江苏,南京,210016 |
| 摘 要： | 采用90 W半导体激光焊接系统对Sn-Ag-Cu无铅钎料在纯铜基板上进行钎焊试验. 针对在不同激光输出功率下形成的微焊点形貌, 分析Sn-Ag-Cu钎料在纯铜基板上的润湿、铺展规律和微焊点的微观组织特征. 通过分析比较在激光软钎焊和红外再流焊2种再流焊加热方式的Sn-Ag-Cu钎料微焊点的微观组织, 发现： 当采用半导体激光软钎焊时存在最佳输出功率, 在此功率下得到的微焊点组织均匀, 晶粒细小, 没有产生空洞缺陷, 力学性能最佳. |
| 关 键 词： | 半导体激光软钎焊 无铅钎料 微观组织 |
| 文章编号： | 1672-7207(2006)02-0229-06 |
| 收稿时间： | 2005-11-01 |
| 修稿时间： | 2005年11月1日 |
Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering |
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| HAN Zong-jie,JU Jin-long,XUE Song-bai,FANG Dian-song,WANG Jian-xin,YAO Li-hua.Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering[J].Journal of Central South University:Science and Technology,2006,37(2):229-234. | |
| Authors: | HAN Zong-jie JU Jin-long XUE Song-bai FANG Dian-song WANG Jian-xin YAO Li-hua |
| Institution: | 1. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China; 2. College of Automation Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China, 3. College of Economics and Management, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China |
| Abstract: | Soldering experiment with Sn-Ag-Cu lead-free solder was carried out on pure Cu substrate using 90 W diode-laser soldering system. The regulations of the wetting and spreadabiiity properties of Sn-Ag-Cu lead-free solder on pure Cu substrate with different laser output powers and the characteristics of microstructures of micro-joints were studied,Compared with microstructures of micro-joints soldered with Sn-Ag-Cu lead-free solder by means of diode-laser soldering system and infrared reflow soldering system, it is found that there is an optimum laser power value on the tensile strength of micro-joints soldered with diode-laser soldering system. The microstructures of the joints soldered with the optimum laser power value are homogeneous. The crystal grains of joints are fine, and no defect exists in the joints. The mechanical properties of the soldered joints with the laser power value of diode-laser output are the best. |
| Keywords: | Sn-Ag-Cu |
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