对某电子设备典型后门耦合效应的仿真分析

为了研究某型电子设备的电磁耦合规律,利用电磁仿真软件FEKO建立了设备模型和所需的电磁场环境.研究表明:无内部设备,当频率在400 MHz以上时设备内部准中心位置呈现中心聚集效应和明显的窗口耦合;有内部设备,当频率在50MHz时门缝处电磁耦合明显,明显的耦合现象发生在500 MHz以上频率,内部设备附近产生强耦合场;在平面电磁波作用下,设备内部电场强度随频率增加逐渐均匀化且数值增大,后门窗口处效应呈现明显增强,内部电磁场发生畸变;仿真结果为实际试验和具有类似尺寸孔隙的设备提供了参考.

Simulation Analysis on Typical Back-door Coupling Effect of One Electronic Equipment

In order to study the electromagnetic coupling law of one electronic equipment,electromagnetic simulation software FEKO was used to set up the equipment model and typical electromagnetic field environments.Data showed:with no inner equipment,centre gathering and obvious window coupling presented around the centre position of the equipment above 400 MHz;with inner equipment,obvious electromagnetic coupling in the slot appeared at 50 MHz,and the obvious coupling phenomenon took place above 500 MHz,with strong coupling field existing near the inside equipment;in the plane-wave field,the electric field intensity developed to symmetrical state and the value increased gradually with frequency rising,and the obvious enhancement effect appeared in the window place of back door,while electromagnetic field distortion happened;the simulation result offered reference for testing and equipment with holes of similar size.