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计算机辅助硅膜片的应变与应力分析
引用本文:李乃平,刘三清,于军.计算机辅助硅膜片的应变与应力分析[J].华中科技大学学报(自然科学版),1990(5).
作者姓名:李乃平  刘三清  于军
作者单位:华中理工大学固体电子学系 (李乃平,刘三清),华中理工大学固体电子学系(于军)
摘    要:膜片式半导体压力传感器是一种以形变引起硅材料电阻率发生变化为原理而制成的器件,因此正确认识硅弹性形变膜片上的应力和应变分布情况是合理布局应变电阻条的前提。根据硅的晶体结构并利用各向异性腐蚀剂,可以较方便地获得周边固定的矩形和方形形变膜片。本文用计算机模拟出应变和应力在这些膜面上的变化规律。


A Computer-Aided Analysis of Stress and Strain on a Silicon Diaphragm
Li Naiping,Liu Sanqing,Yu Jun.A Computer-Aided Analysis of Stress and Strain on a Silicon Diaphragm[J].JOURNAL OF HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY.NATURE SCIENCE,1990(5).
Authors:Li Naiping  Liu Sanqing  Yu Jun
Institution:Li Naiping Liu Sanqing Yu Jun
Abstract:A good understanding of the stress and strain distribution on an elas-tically deformed diaphragm is of importance to the optimal design of a diaphragm type pressure sensor. Computer simulation has been made to study respectively the distribution of the direct stress, shearing stress, direct strain and shearing strain on rectangular and square silicon diaphragms. It has been found that computer-aided programming can not only give a quick and clear picture of the properties and magnitudes of the stress and strain and the effect of diaphragm geometry on them, but also makes possible their observation and display from different angles.
Keywords:Theory of elasticity  Stress  Strain
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