IGBT功率模块热管理研究

随着绝缘栅双极晶体管(IGBT)向高功率和高集成度方向发展,在结构和性能上有很大的改进,热产生问题日益突出,对散热的要求越来越高,IGBT芯片是产生热量的核心功能器件,但热量的积累会严重影响器件的工作性能。因此,对IGBT模块的温度进行有效地检测和管理是十分重要的环节。综述了IGBT模块的研究现状、研究热点以及散热相关技术,主要介绍了主动散热和被动散热的方法、以及IGBT功率模块的热阻网络系统和散热系统设计的主要步骤,和减小热阻来增强散热的方法。

Research of Thermal Management of IGBT Power Modules

With the development of insulated gate bipolar transistor (IGBT) towards high power and high integration, great improvement has been made in structure and performance. The problem of heat generation is increasingly prominent, and the requirement of heat dissipation is higher and higher. IGBT chip is the core functional device that generates heat, but the accumulation of heat exerts an adverse effect on the performance of the device. Therefore, it is of great significance to detect and manage the temperature of IGBT module effectively. The research status, research hotspot and heat dissipation technology of IGBT module were summarized, the methods of active and passive heat dissipation were introduced in detail. In order to further understand the thermal management of IGBT module, the main steps of the thermal resistance network system and the cooling system design of IGBT power module, as well as the method of enhancing the cooling by reducing the thermal resistance were introduced.