光固化微压印脱模过程对制品精度影响的研究

光固化微压印制品的脱模过程直接关系到制品的质量。利用ABAQUS软件对圆柱微结构阵列的光固化微压印脱模过程进行数值模拟，分析了光固化微压印出现撕裂和断晶缺陷的原因，并利用自制紫外光固化微压印成型实验平台研究了脱模过程对微结构阵列薄膜精度的影响。在光固化微压印脱模过程中，应力集中主要发生在圆柱微结构的表面及根部，当黏附力与摩擦力之和大于制品的内聚力时会带来制品缺陷。

Effect of the photocuring microimprint demolding process on product precision

The demolding process of photocuring microimprinting products has a significant influence on the quality of the products. In this paper, ABAQUS software was used to numerically simulate the process of photocuring microimprinting demolding of cylindrical microstructural arrays, and the causes of tearing and crystal breaking defects in the photocuring micro-imprinting process were studied. A self-made UV curing microimprinting experimental platform was used to experimentally study the effect of the demolding process on the film precision of the microstructural array. In the process of photocurable microimprint demolding, the stress concentration mainly occurs on the surface of the cylindrical microstructure and in the root of the microstructure. When the sum of the adhesion force and friction force is greater than the cohesion force of the product, defects will be generated in the product.